FSAM is a powerful tool to inspect and evaluate products:
welding structure, solder joints,
semiconductor packages, wafer.
The scanning speed of our FSAM enables video-rate two-dimensional B-scan ultrasound imaging (up to 46 fps over a 20mm range).
The system can be used to detect voids, disbonds, cracks, delamination, internal defects, bubbles, or changes of mechanical properties inside samples without any damage.
Extremely fast, high speed, smooth scanning by dual-channel in conjunction with our exclusive fast-scanning mechanism
Image enhancement and analysis. Multi gates and 3D scan.
High resolution images by high-frequency ultrasonic transducer.
Automatic defect identiﬁcation.
User friendly operation software.
Customize to customer speciﬁcation.
SCANNING ENVELOPE 100㎜
FAST TRAVEL 50㎜
No. OF CHANNELS 2
MAX. FRAME RATE 16fps
VERTICAL FSAM (3-axis)
· SCANNING ENVELOPE 157mm · FAST TRAVEL 40mm · No. OF CHANNELS 4 · WITH A WATER TANK
HORIZONTAL FSAM (2-axis)
· SCANNING ENVELOPE 100mm · FAST TRAVEL 26mm · No. OF CHANNELS 4 · WITH A WATER TANK
TRADITIONAL SAM (3-axis)
· SCANNING ENVELOPE 300mm · FAST TRAVEL (by a linear servo motor) 450mm · No. OF CHANNELS 2 · WITH A WATER TANK
C-San 결함 발견 사진
The scanning speed of our FSAM enables video-rate two-dimensional
B-scan ultrasound imaging (up to 100 fps over a 5-mm range).
SCANNING RANGE 5㎜
No. Offas Mechanisms 2
Distance between 2 Mechanisms 170mm
MAX. FRAME RATE 100fps
C-San 결함 발견 사진