We are actively striving to provide fast and accurate system.
FSAM is a powerful tool to inspect and evaluate products: welding structure, solder joints, semiconductor packages, wafer.
The system can be used to detect voids, disbonds, cracks, delamination, internal defects, bubbles, or changes of mechanical properties inside samples without any damage. The scanning speed of our FSAM enables video-rate two-dimensional B-scan ultrasound imaging.
Extremely fast, high speed, smooth scanning by dual-channel in conjunction with our exclusive fast-scanning mechanism
High resolution images by high-frequency ultrasonic transducer.
User friendly operation software.
Customize to customer speciﬁcation.
Image enhancement and analysis. Multi gates and 3D scan.
Automatic defect identiﬁcation.
The motivation of PAM is to unite strong intrinsic
(i.e., oxyhemoglobin, deoxyhemoglobin, melanin, etc.) and extrinsic (i.e., organic dyes, metallic and nonmetallic nanoparticles, etc.) optical absorption contrast and high ultrasonic resolution in a single imaging modality.
PAM includes optical resolution PAM (OR-PAM) and acoustic resolution PAM (AR-PAM).