High-Frequency
Ultrasound Inspection Platform
OHLABS · High-Frequency Ultrasound NDT
High-Frequency Ultrasound Inspectionfor Advanced Packaging
Seeing what optical inspection cannot, OHLABS reveals hidden defects inside semiconductors, batteries, and industrial materials with high-frequency ultrasound scanning.
FSAM-400 Live ScanNon-Destructive Internal ViewSemiconductor Packaging
Non-Destructive
Internal Defect Visualization
Sub-surface
Void · Crack · Delamination
Automation Ready
From Lab Analysis to In-line Systems
Dual FSAM
Robot transfer, then dual-sided scan.
A sample carrier moves into the inspection zone, the robot arm positions it, and the top emitter with the bottom receiver scan the part in sync.
Sample transfer from load bay to stage
Dual-sided ultrasonic alignment
Scan beam and result pulse loop
Technology
Core technology first, product discussion second.
OHLABS should be understood as a technical inspection company: acoustic hardware, scanning architecture, laser ultrasound direction, and software analysis working together.
High-Frequency Ultrasound
Core acoustic inspection technology for visualizing internal defects without cutting, polishing, or damaging the sample.
- Internal void, crack, and delamination detection
- Material interface analysis
- Non-destructive sample review workflow
FSAM Scanning Architecture
Fast scanning acoustic microscopy architecture designed for advanced packaging, wafer, and precision material inspection.
- Scanning matrix control
- C-scan image acquisition
- Automation-ready inspection flow
Laser Ultrasound Microscopy
Laser-based ultrasound inspection concept for contact-sensitive samples and advanced research workflows.
- Non-contact excitation direction
- Microscopy-scale defect visualization
- Research-to-industrial expansion path
AI Defect Analysis
Software-assisted image review for classifying defect patterns and turning scan images into actionable engineering evidence.
- Defect pattern grouping
- Scan result comparison
- Engineer-friendly reporting structure
Applications
Built for hidden defects in advanced materials.
The site leads with HBM and advanced packaging, then expands into batteries, power devices, MEMS, composites, and industrial inspection.
HBM / Advanced Packaging
Internal inspection for stacked packages, bonding interfaces, and hidden voids in advanced semiconductor packaging.
VoidDelaminationBonding failure
Semiconductor Wafer
Wafer-level acoustic imaging for internal defects that optical inspection cannot expose.
Sub-surface crackInterface defectParticle-related anomaly
Power Semiconductor
Inspection support for modules where bonding quality and thermal reliability matter.
Die attach voidSolder delaminationInterface separation
Validation & Resources
Validated by Scan Results, Not Claims
The strongest sales material is direct evidence: what optical inspection misses, what ultrasound reveals, and how each defect type appears in scan data.
Resource
Optical vs Ultrasound Comparison
Side-by-side evidence showing why internal defects require acoustic inspection instead of surface-only review.
Resource
Defect Type Library
A practical visual library for void, crack, delamination, and bonding anomaly patterns.
Resource
Sample Scan Report
A buyer-friendly report structure for scan conditions, images, findings, and next inspection recommendations.
Resource
Downloads
A future hub for datasheets, catalog PDFs, application notes, and scan request guides.
Company
Originated from NBMLAB research, built for industrial inspection.
OHLABS commercializes high-frequency ultrasound non-destructive inspection technology from Pukyong National University NBMLAB into practical systems for global engineering teams.
Sample Scan Request
Send Us Your Sample. We'll Review Scan Feasibility.
Share your material, target defect, and inspection requirements. OHLABS will recommend a practical scan path before equipment discussions begin.