Automation SAM Series End-to-End Automation — One Step Closer to Perfection
Higher productivity. Higher quality. Lower cost.
These are the three core values delivered by Automation SAM.
From pick & place and ultrasonic scanning to drying and data analysis, every step of the inspection process is fully automated overcoming the limitations of conventional systems. Inspections are faster, more accurate, and significantly more efficient. Automation SAM goes beyond automation, setting a new benchmark for semiconductor inspection systems.
USI TSAM 350
Fully Automated Inspection System for Power Semiconductors
Integrated pick & place, simultaneous dual-side scanning,
AI-based inspection, and drying
USI RSAM 300
Fully Automated Inspection System for Semiconductor Wafers
Complete automation including cassette loading/unloading,
rotary scanning, AI-based inspection, and drying