RSAM-12”

Redefining the Paradigm of Wafer Inspection

RSAM-12”

Rotary-Scanning Ultrasonic NDT System Optimized for Wafer Analysis

RSAM-12" is a rotary-scanning ultrasonic non-destructive testing system specifically developed for high-efficiency wafer inspection.

Rotary Scanning for<br> Maximum Efficiency

Rotary Scanning for
Maximum Efficiency

A rotating sample architecture improves inspection throughput and data precision simultaneously

Minimized Redundant <br> Scanning

Minimized Redundant
Scanning

Eliminates unnecessary scan regions to maximize data acquisition efficiency

High-Purity <br> Imaging Data

High-Purity
Imaging Data

Noise-reduced, high-resolution ultrasonic images captured in real time

Reliable and <br> Repeatable Results

Reliable and
Repeatable Results

Delivers consistent accuracy and data quality across repeated inspections

Application Samples & Scanning Images

Dual FSAM

Technical
Specifications

Technical Specifications
Model RSAM-12"
Scanning range 300 (X) x 300 (Y) mm
Scanning velocity 3.5 rps
Step size 10 ~ 200 µm
Frequency range 5 ~ 200 MHz
Number of channels 1
Digitizer PCle 16bits 1GSPS
Size 850 (W) x 850 (D) x 1,400 (H) mm
Weight 350 kg

※ All specifications are fully customizable to meet customer requirements.