USI TSAM 350
Maximizing Quality and Efficiency through Full Automation
Next-Generation Ultrasonic NDT System Combining Precision and Speed
USI TSAM 350 is a fully automated SAM system specifically designed for power semiconductor inspection.
End-to-End
Automation
Fully automated handling, scanning, and drying processes
Vacuum Gripper
Pick & Place
Precise and stable sample positioning with a high-accuracy vacuum gripper
High-Resolution
Ultrasonic Scanning
Clear detection of micron-level defects with high-resolution imaging
Instant
Defect Identification
Immediate defect evaluation based on scanned data
Real-Time
Inspection Monitoring
Instant visualization of inspection results for rapid process decisions
Video
Scanning Image Results
Technical
Specifications
| Technical Specifications | |
|---|---|
| Model | USI TSAM 350 |
| Scanning technique | Real time A, B, C, T–scan |
| Scanning range | 350 (X) x 350 (Y) mm |
| Scanning velocity | Max. 1,000 mm/s |
| Step size | 10 ~ 200 µm |
| Transducer |
Frequency: 50 ~ 100 MHz Focal length: 8 ~ 12 mm |
| Number of channels | 2 |
| Digitizer | PCle 16bits 1GSPS |
| DI water |
Temperature: 20 ~ 30 °C Pressure: 0.1 ~ 0.2 MPa Flow: 4 ~ 6 L/min |
| Air Supply | CDA 0.5 ~ 0.7 MPa Peak 500 L/min @ 0.6 MPa |
| Operating Environment |
Temperature: 15 ~ 30 °C Humidity < 85 % (non-condensing) |
| Power | 200 ~ 240 VAC, 60 Hz, 75 A, Three Phase |
| Size | 1,570 (W) x 1,830 (D) x 1,970 (H) mm |
| Weight | 1,880 kg |
※ All specifications are fully customizable to meet customer requirements.