USI RSAM 300
Maximizing Quality and Efficiency through Full Automation
Next-Generation Ultrasonic NDT System Combining Precision and Speed
USI RSAM 300 is a fully automated SAM system specifically designed for wafer inspection.
End-to-End
Automation
Automated control from cassette loading to air-knife drying
Inspection Completed in Under
3 Minutes
Fast inspection of 12-inch wafers for high-throughput operation
High-Resolution
Ultrasonic Scanning
Clear detection of micron-level defects with high-resolution imaging
AI-Based
Analysis
Improved accuracy and efficient data management for high-volume inspections
Scanning Image Results
Technical
Specifications
| Technical Specifications | |
|---|---|
| Model | USI RSAM 300 |
| Scanning technique | Real time A, B, C–scan |
| Scanning range | 300 (X) x 300 (Y) mm |
| Scanning velocity | Max. 500 rpm |
| Step size | 10 ~ 200 μm |
| Transducer |
Frequency: 50 ~ 200 MHz Focal length: 3 ~ 12 mm |
| Number of channels | 1 |
| Digitizer | PCIe 16bits 1GSPS |
| DI water |
Temperature: 20 ~ 30 ℃ Pressure: 0.1 ~ 0.2 MPa Flow: 4 ~ 6 L/min |
| Air Supply | CDA 0.5 ~ 0.7 MPa Peak 500 L/min @ 0.6 MPa |
| Operating Environment |
Temperature: 15 ~ 30 ℃ Humidity < 85 % (non-condensing) |
| Power | 200 ~ 240 VAC, 60 Hz, 50 A, Three Phase |
| Size | 1,390 (W) x 2,390 (D) x 2,000 (H) mm |
| Weight | 2,410 kg |
※ All specifications are fully customizable to meet customer requirements.