FSAM-400
A New Standard in Scanning Speed
Next-Generation Ultrasonic NDT System Delivering Both Precision and Speed
Up to 30× Faster
Inspection Speed
Proprietary high-speed scanning module enables up to 30× shorter tact time compared to conventional systems
Ultra-Fast Wafer Inspection
12-inch wafers in 3 minutes, 8-inch wafers in 1 minute 15 seconds
10× Faster than TSAM Systems
Delivers a tenfold improvement in scanning speed and data processing efficiency over previous-generation platforms
Micron-Level Defect Detection
High-resolution imaging identifies micro-voids, delamination, and interlayer defects with precision
Reliable,
High-Quality Data
Multi-channel, wideband receiver architecture ensures stable and repeatable inspection results
Video
Application Samples & Scanning Images
Technical
Specifications
| Technical Specifications | |
|---|---|
| Model | FSAM - 400 |
| Scanning range | 100 (X) x 380 (Y) mm |
| Scanning velocity | 24 fps |
| Step size | 10 ~ 200 µm |
| Frequency range | 5 ~ 200 MHz |
| Number of channels | 1 , 2 , 4 |
| Digitizer | PCle 16bits 1GSPS |
| Size | 1,260 (W) x 1,100 (D) x 2,300 (H) mm |
| Weight | 300 kg |
※ All specifications are fully customizable to meet customer requirements.