TSAM-400

Proven Technology, A Standard You Can Rely On

TSAM-400

Key Features

An ultrasonic non-destructive inspection system widely utilized across the entire workflow
from research and development to mass-production quality control.

Featuring a replaceable transducer architecture, the system supports low-, mid-, and high-
frequency bands
, delivering optimal resolution and accurate inspection across a wide range of material thicknesses and compositions.

High-Resolution Inspection

High-Resolution Inspection

Micrometer-level (µm) resolution for
precise internal defect analysis

Wide Frequency Coverage

Wide Frequency Coverage

Interchangeable transducers supportinglow, mid, and high frequency ranges

Proven <br> Stability

Proven
Stability

Industry-standard technology ensuring reliable long-term operation

Broad Material Compatibility

Broad Material Compatibility

Applicable to semiconductors, electronic components, ceramics, and composites

Standard Inspection Workflow

Standard Inspection Workflow

Built-in A/B/C-Scan, Gating, and ToF-based evaluation

Applications

  • Semiconductors & Advanced Packaging:Die attach, bumps/solder joints, underfill, molding compounds, TSV/TGV, interposers
  • Power & Power Semiconductor Devices:Internal defect inspection of IGBT/MOSFET modules, interface delamination, void detection
  • Glass PCB & Next-Generation Substrates:Interface analysis of glass cores and interposers, micro-defect diagnostics
  • Passive Components & Ceramics:MLCCs, ceramic substrates, composite material delamination
  • Adhesive Bonding & Composites:Film and adhesive layer uniformity, laminate integrity, degradation after moisture and thermal stress

Core Advantages

  • 정밀 데이터 분석

    Industry-Proven Reference System

  • 정밀 데이터 분석

    High Versatility Across Multiple Industries

  • 정밀 데이터 분석

    Optimized Imaging Performance Through
    Multi-Band Frequency Support

Video

Application Samples & Scanning Images

TSAM-400
TSAM-400
TSAM-400

Technical
Specifications

Technical Specifications
Model TSAM - 400
Scanning range 400 (X) x 400 (Y) mm
Scanning velocity Max. 1,000 mm/s
Step size 10 ~ 200 μm
Frequency range 5 ~ 200 MHz
Number of channels 1, 2, 4, 8
Digitizer PCIe 16bits 1GSPS
Size 1,260 (W) x 1,100 (D) x 2,300 (H) mm
Weight 300 kg

※ All specifications are fully customizable to meet customer requirements.